21 May 2018
Concurrent Technologies Plc
Rugged VPX Server Boards
Concurrent Technologies Plc (AIM: CNC), a world leading specialist in the design and manufacture of high-end embedded computer boards for critical applications, is pleased to announce a range of rugged VPX boards that have now completed thermal, shock and vibration qualification testing.
The VPX range is based on the Intel® Xeon® processor family and variants can be customised with a range of memory and security enhancements without compromising the minimal size, weight and power (SWaP) characteristics of the boards.
This combination of processing power, small SWaP footprint, robust security and capability to operate in extreme environments is ideal for the defence sector where this class leading technology is expected to be integrated into both battlefield and support applications.
Glen Fawcett, CEO, Concurrent Technologies Plc, commented: “Our focus was to design these boards to optimise server performance for extreme environments and to minimize our SWaP characteristics. Having completed the necessary qualifications, we are now selling class leading, single slot server products that are capable of operating at full processor loading irrespective of the card edge temperature.”
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About Concurrent Technologies Plc
Concurrent Technologies Plc develops and manufactures high-end embedded computer products for use in a wide range of high performance, long life cycle applications within the telecommunications, defence, security, telemetry, scientific and aerospace markets, including applications within extremely harsh environments. The processor products feature Intel® processors, including the latest 8th generation Intel® Core™ processors, Intel® Xeon® and Intel® Atom™ processors. The products are designed to be compliant with industry specifications and support many of today’s leading embedded Operating Systems. The products are sold world-wide.
For more information on Concurrent Technologies Plc and its products please visit www.gocct.com.
All trademarks, registered trademarks and trade names used in this announcement are the property of their respective owners.